ADTEC Automatic UV Exposure System for Solder Resist (ADEX3000S)

ADTEC Automatic UV Exposure System for Solder Resist (ADEX3000S) 

The ADEX3000S is fully automatic exposure system for solder resist imaging process. Requirements for accuracy and high productivity have been successfully addressed.

A special function is added to prevent or minimize adhesion to resist substrate.

Features

Alignment accuracy

·    The inner alignment system realizes a high-accuracy alignment of ±10µm (at the distribution position of the mark). The position confirmation that is conducted immediately before exposure also improves the reliability of the alignment accuracy.

One piece table structure

·        The seamless one-piece table ensures the correct level of exposure for thin substrates. This simple table structure also serves to minimize the generation of dust.

High speed substrate transport mechanism

·        The linear motor achieves a high-speed and high level of accuracy, and minimizes the generation of dust during substrate transportation.

Clean room compatibility

·        The stainless steel cover and HEPA-filtered clean air that is blown onto the top surface of the mask holder together minimize defect caused by dust.

Tacking issue resolution

Due to the sticky nature of solder resist, ADTEC Engineering has designed the ADEX3000S to tightly control the temperature of the exposure room, as well as, the exposure stage (platen). 

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