PDR IR-XT5P– Top of the range for BGA Rework

PDR IR-XT5A – Top of the range for BGA Rework

The advanced PDR IR-XT5A SMT/BGA Rework System takes the repair of the latest PCB assemblies in its stride, easily overcoming the frustrations and complexities of 'high end' rework.

The system is tip/nozzle free, instantly and precisely controllable, clean and produces high quality BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs and Flipchips, and is ready for 0201 and lead-free applications.

The IR-XT5P comes with a good range of standard features allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It’s hands-free, semi-automated and comes with PDR’s user-friendly ThermoActiv V3 software suite.

• Ideal for the hidden interconnects in a high density environment
• Produces 100% yield BGA rework without any complications
• Instant, visible, highly controllable heating
• Tool free and gas free
• Modular and upgradeable

PDR IR-XT5P - Features And Specifications

Advanced FIR Component Heating

• Lens based FIR heating with adjustable image system
• PDR lens attachments with IR image from 4 to 70mm diameter
• Reworks all SMDs/BGAs including 0201s + lead free applications 

Large Area IR PCB Preheater System

• Medium wave IR PCB preheating
• 1200W (2 x 600W switchable)
• 2 zones (inner - 120mm x 300mm) and (inner + outer - 240mm x 300mm area) 

PDR Lens Attachments

• F700 (25 -70mm spotsize) standard

Precision Pick-up System

• Vacuum operated pick and place with precise macro-micro Z axis movement
• Micrometer control for soft component landing 360° component rotation
• Component nest and 'print frame' facility for paste application 
• Macro-Micro X/Y PCB Table

Precision micrometer (Micro) control

• +/- 10 microns (.0004") movement in X/Y directions
• Macro override facility in all directions
• Up to 17" x 20" (420mm x 500mm) capacity with lockable XY axis 

Non-Contact, IR Sensor for Measuring Component Temperature

• Manually adjustable, K-type non-contact IR sensor
• Realtime monitoring of component temperature throughout process 

K-Type Contact Probe for Measuring PCB Temp.

• Manually attached, K-type thermocouple contact probe
• Realtime monitoring of PCB temperature throughout process 

PDR ThermoActive V3 Software SuiteType 5, Digital controller

Multi K-type thermocouple (x4) capacity for temp/time testing

Windows 98/me/XP/NT Thermo Active V3 softwareClosed loop component/PCB temp control

Drag and drop profile setting 

Customer Reviews:

You may also be interested in this/these product(s):

PDR IR-XT5M MPR- Number 1 for BGA Rework on Mobile Phones  Call for Pricing

PDR IR-XT5M MPR- Low Cost, Upgradeable BGA Rework System  Call for Pricing

PDR IR-810/620 SOLDERLIGHT - BGA Rework In A Hand Tool  Call for Pricing

PDR IR-XT5A - Low Cost, Upgradeable BGA Rework System  Call for Pricing