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Products and Services arrow Products and Services arrow AUTOMATIC EXPOSURE MACHINE & SUPERGAUGE arrow ADTEC Full Automatic Exposure System arrow ADTEC Automatic UV Exposure System for High Definition Board
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AUTOMATIC EXPOSURE MACHINE & SUPERGAUGE arrow ADTEC Full Automatic Exposure System arrow ADTEC Automatic UV Exposure System for High Definition Board



ADTEC Automatic UV Exposure System for High Definition Board


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ADTEC Automatic UV Exposure System for High Definition Board

 

 

The ADEX5100 Series is the highest precision model with U-Shape vacuum contact method exposure machine, equipped with a step&repeat shutter in order to improve film to panel accuracy, a requirement for high density PCB production. 

 

 

 

adex5100_series

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Features

Shutter mechanism divides panel into separate exposure sections

·    To minimize the effect of the expansion and shrinkage of the board or mask, the shutter blocks the light to areas other than the exposure area. The number of sections a board can be divided into user-defined as 2/3/4/6. Alignment is made prior to each section being exposed. The number of sections to be exposed separately depends on the accuracy required by the board.

 

 

Applicable to thin boards

·    In order to accept ultra-thin boards (0.025mm) such as flexible boards, separate backlights were eliminated and a seam-free, one piece exposure platen with backlight that can prevent poor contact due to exposure (platen) stage unevenness. Vacuum pads are used to transport the board enabling high-speed and stable transportation.

·    Also, non-contact vacuum pads are added in the exposure area of ADEX5100S1/S2 for solder registration minimizing the contact zone around the edge of board.

 

 

Expendable changes, maintenance timing control function

·    The initial setting of maintenance for each part make machines indicate warning during production alerting the operator.

 

 

U-Contact method

·    Our proprietary U-contact method significantly improves the vacuum contact and eliminates the need for the spacers. The U-contact method is vacuum contact method, which bends the glass and starts the vacuum from the center of the board, minimizing air bubbles. In addition to the standard method mounted spacer-less mode (SL mode), the high resolution mode (HR mode), achieves even higher resolution by limiting the board size 410x510mm is prepared as an option.

Automatic platen/mask cleaner

· Automatic mask and platen cleaning by clean rollers and dust collection nozzle minimizes the effects of dust brought in by boards. The frequency of the automatic cleaning cycle is use definable.





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