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Laser Machining Appilcation |
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| Price per Unit (piece): Call for Pricing |
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![]() ![]() ![]() Cutting and slotting of Via hole drilling of copper Logo cutting of copper polyimide film at 355nm orifice at 532nm sheet at 532nm ![]() ![]() ![]() Cutting and drilling silicon Drilling of diamond die via hole drilling sapphire wafer at 1064nm at 1064nm wafer at 355nm |
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